The next generation chips from IBM is to be powered with DNA if sources are to be believed. “The cost involved in shrinking features to improve performance is a limiting factor in keeping pace with Moore’s Law and a concern across the semiconductor industry,” said Spike Narayan, manager, Science & Technology, IBM Research – Almaden.
“The combination of this directed self-assembly with today’s fabrication technology eventually could lead to substantial savings in the most expensive and challenging part of the chip-making process.” This would mean researchers could pack in more speed and computational powers into chips.
The challenge faced by the semiconductor industry is developing the necessary lithographic technology for features sizes smaller than 22nm. The ability of the DNA structures which can serve as scaffolds or miniature circuit boards they hope will help in developing the necessary technology to overcome the sub 22nm problem. This allows the possibility to assemble components precisely on a much smaller scale.